Electron Devices
Panel Devices
R&D Equipment
Vacuum Components
Maintenance Services
Corporate Data
Environmental Efforts
Quality Control
Location and Map
Topics
Event Information
Fukutaro's Room
Inquiries and comments
Support service network
Sales representative network
World of technology
Advanced technologies explained by graphics
Vacuum seminar
Simple explanation of the basics of vacuum technology
2010.2.1
Canon ANELVA Corporation amalgamated with Canon ANELVA Engineering Corporation and Canon ANELVA Technix Corporation.
2007.8.20
The location of our head office changed.
2007.7.16
The address of Taiwan Branch Office was changed.
2007.2.24
The address of a Korea Branch Office was changed.
2007.1.3
CANON ANELVA CORPORATION SINGAPORE BRANCH was established newly.
2006.4.24
The address of a USA branch was changed.
2006.4.1
The Singapore center was established newly.
2005.10.1
Information of company name change.
2005.08.26
Acquisition of our entire shares by Canon
2005.06.08
NTSL became an Anelva Corporation Group Company.
2004.09.07
TMR Device with World Best Performance Fabricated by Mass Manufacturing System
2004.04.19
Release of metal-CVD equipment for experiments and small-size production of MEMS
2004.03.17
"Nanocrystalline silicon" thin film achieved by nano-controlled chemical vapor deposition technique
2004.03.12
Release of PVD packaging equipment for 300-mm substrates