Exhibit at 18th IC Packaging Technology EXPO

It is our great pleasure to inform you that we will be introducing our products during 18th IC Packaging Technology EXPO (January, 18th – 20th, 2017) in Tokyo Big Sight, Japan.


Wednesday, January 18, 2017 (10:00 AM to 6:00 PM)

Thursday, January 19, 2017 (10:00 AM to 6:00 PM)

Friday, January 20, 2017 (10:00 AM to 5:00 PM)


Tokyo Big Sight, Japan

Booth No.

West Hole, W4-20


  1. EL3400  Advanced Packaging High Productivity PVD Equipment
  2. G-311MH  Microfocus X-ray Source
  3. M-080QA-HPM  Quadrupole Mass Spectrometer (Process Gas Monitor)
  4. M-212LD(-D)/M-222LD(-D)/M-232LD  Helium Leak Detector HELEN Series
  5. M-342DG  Capacitance Diaphragm Gauge

For any enquiries, Please contact as below address

Equipment :

Canon ANELVA Corporation, Product marketing department

Email :

Vacuum Components :

Canon ANELVA Corporation, FS marketing department

Email :

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