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Exhibit at ECTC (Electronic Components and Technology Conference) 2017

We are pleased to announce that Canon U.S.A. will exhibit Micro Focus X-ray Source, Sputtering Equipment for Panel Level Advanced Packaging and Atomic Diffusion Wafer Bonding Technology at the Walt Disney World Swan and Dolphin Resort, in Lake Buena Vista, Florida, USA on May 31 and June 1.

Dates

Wednesday, May 31, 2017 (9:00 AM to 6:30 PM)

Thursday, June 1, 2017 (9:00 AM to 4:00 PM)

Venue

Walt Disney World Swan and Dolphin Resort, in Lake Buena Vista, Florida, USA

Booth No.

#418 (In the booth of Canon USA Inc. )

Exhibit
  1. Atomic Diffusion Wafer Bonding Technology
  2. EL3400  Sputtering Equipment for Panel Level Advanced Packaging
  3. G-311MH  Microfocus X-ray Source

For any enquiries, Please contact
 USA   : Canon USA Inc., Industrial Products Division Canon ANELVA Products
            Phone : +1-408-468-2000
            Email : semi-info@cusa.canon.com
 Japan : Canon ANELVA Corporation, Product marketing department
            Email : marketing@canon-anelva.co.jp

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