News

Topics

Exhibit at 19th IC Packaging Technology EXPO - NEPCON JAPAN 2018 -

It is our great pleasure to inform you that we will be introducing our products during 19th IC Packaging Technology EXPO (January, 17th – 19th, 2018) in Tokyo Big Sight, Japan.

Dates

Wednesday, January 17, 2017 (10:00 AM to 6:00 PM)

Thursday, January 18, 2017 (10:00 AM to 6:00 PM)

Friday, January 19, 2017 (10:00 AM to 5:00 PM)

Venue

Tokyo Big Sight, Japan

Booth No.

East Hole, E25-4


nepcon2018_canon-anelva_booth

Access

http://www.bigsight.jp/english/hotel/transportation/

Exhibit
  1. <Limited Sale> BC7000  Atomic Diffusion Bonding Equipment
    BC7000 New product
  2. EL3400  Advanced Packaging High Productivity PVD Equipment
  3. <New product> G-311 D-series  Microfocus X-ray Source
    G-311_D-series New product
  4. C-series  Compact Gas Analysis System
  5. M-212LD(-D)/M-222LD(-D)/M-232LD  Helium Leak Detector HELEN Series
  6. <New product> Cold Cathode Gauge Series

    M-361CP  Cold Cathode Pirani Gauge
    M-370CG  Cold Cathode Gauge

    Cold Cathode Gauge M-361,370 New product

For any enquiries, Please contact as below address

Equipment :

Canon ANELVA Corporation, Sales Promotion Department

Email : marketing@canon-anelva.co.jp

Vacuum Components :

Canon ANELVA Corporation, Sales Promotion Department

Email : support@canon-anelva.co.jp

Back to Page top