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Release of PVD packaging equipment for 300-mm substrates

High performance and high customizability realized in new PVD module

In today's global semiconductor industry, significant capital is being invested in digital household equipment, mobile phones, and automobile electronics devices, where Japan plays a leading role, to cope with the ever-increasing demand for PCs. As companies in the industry start adopting the 300-mm-substrate production line, the CSP market is also expanding dramatically.

In view of these circumstances, we developed a PVD equipment for packaging 300-mm substrates on the production line (assembly and testing process).

【Equipment and Performance】

Name: PVD Packaging Equipment for 300-mm Substrates

Mode: I-1201CX

・ Thickness uniformity: ±5.0% or lower for various materials

(Ti, Ni, Al, TiW, Cu, WSi, etc.)

・ Substrate temperature: 150°C or lower (sputtering, etching)

・ Etching distribution: ±5.0% (13.56 MHz, ICP)

PVD Packaging Equipment for 300-mm Substrates

Features

Making the most of thin-film processing technology used for the wafer process, we achieved a low-cost module of simple structure with optimized units to satisfy the demand from the "packaging" market.
The equipment features adoption of the process with no damage, high performance with up to 6 mounted process modules, and superior customizability.
In addition, the equipment has reached a high degree of maturity with significantly reduced total running cost achieved through the use of a new cathode (CX-PMC) with improved adhesion efficiency and extended service life of magnetic material targets.

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