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Release of metal-CVD equipment for experiments and small-size production of MEMS

Deposition of barrier films and Cu films allowed in one chamber

We developed a MEMS-compliant metal-CVD equipment (equipment for R&D and small-size production).
With this equipment, barrier films (TiN) and Cu films can be deposited by MO-CVD within one chamber (two-in-one function).


Our MEMS business

The development and manufacturing of products based on MEMS technology and high-density packaging technology have recently attracted much government attention as a major driving force of Japanese industry in the future, and these technologies are now being actively promoted. The Japanese manufacturing industry, which has developed its technical power based on semiconductor, LCD, and PDP manufacturing and is moving into MEMS substrate technology, will continue utilizing its international competitiveness in the field of MEMS.
As part of our efforts to develop products based on MEMS technology, we have expanded the line of PVD (sputtering/deposition), dry etching, and MO-CVD equipments. We assist the MEMS businesses of our customers (by combining needs and seeds), making the most of our unique technologies.


Features

The major feature of this equipment is that perfect films can be deposited even in micropores having blind spots into which films cannot be deposited by conventional methods (such as sputtering and deposition).
This equipment, which can be used to form wiring into via holes of an Si interposer (wiring holes for connecting the surface with the back through thin wafers), which is essential in 3D packaging, will becoming increasingly utilized.
The photo shows an example of deposition using the feature. It indicates that films have been deposited even on minute uneven parts with superior coating performance, proving that deposition can be performed even in minute gaps, provided that gas can enter them.
 

Equipment

Name: MeMOS (Metal-MOCVD) equipment
Model: L-700CMO