Joint exhibit at Microelectronics Show 2018

It is our great pleasure to inform you that we will be introducing our new bonding equipment at the booth of Tohoku Univ. during Microelectronics Show 2018 (June, 6th – 8th, 2018) in Tokyo Big Sight, Japan.

FPD China 2018


Wednesday, June 6, 2018 (10:00 AM to 5:00 PM)

Thursday, June 7, 2018 (10:00 AM to 5:00 PM)

Friday, June 8, 2018 (10:00 AM to 5:00 PM)


Tokyo Big Sight, Japan

Booth No.

East Hall 8 Academic Plaza
*In the booth of Frontier Research Institute for interdisciplinary Sciences, Shimatsu Laboratory, Tohoku University


  1. BC7000  Atomic Diffusion Bonding Equipment
BC7000 新発売

For any enquiries, Please contact as below address

Equipment :

Canon ANELVA Corporation, Product marketing department

Email :

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