PVD Equipment for R&D  EB1000

Equipment for Electronic Device Manufacturing and for R&D

The EB1000 is a PVD equipment for R&D with enhanced functions to support simultaneous 3-source sputtering and high temperature heating of substrates while reducing the required space. It is equipped with load lock chamber(option) and provides automated pumping operation as standard to support R&D applications in a variety of fields.

EB1000  PVD Equipment for R&D

Applications

R&D

Features

  • Fully automated vacuum pump operation (Touch screen operation)
  • Equipped with three φ2" compact cathodes
  • Simultaneous 3-source sputtering (Option)
  • Support for various substrate size (≤ φ100mm) and deposition methods (offset self-rotational deposition, static facing deposition) by tray transport
  • Space saving achieved by compact design

Specifications

System configuration:
Tray transport method (Load lock is option)
Substrate size:
φ150mm maximum (Have it of load lock;greatest φ100mm)
Cathode:
φ2" cathode ×3
Operation method:
Auto pumping operation, manual transport/deposit operation
Footprint:
W1800mm×D1100mm×H1550mm (standard specification)


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