Advanced Packaging High Productivity PVD Equipment  EL3400

Equipment for Electronic Device Manufacturing and for R&D

EL3400 supports packaging (PLP, WLP) wiring to various substrate required for next-generation high-density mounting technology such as interposer and Fan-out.
The sputtering process with high adhesion enables the high-density circuit formation required for next-generation devices.

EL3400  Advanced Packaging High Productivity PVD Equipment

Applications

Advanced packaging process

Features

  • Achieves high adhesion on various substrates
    (Corresponding substrate example: Resin, Ceramic, Glass, Sillicon wafer)
  • Single-sided sputtering or double-sided sputtering can be selected according to the process applied.

Specifications

System configuration:
Vertical Inline configuration
Applicable process module for one side will be as follows
• Anneal module
• Sputtering module
Substrate:
□650mm
□300mm
φ300mm


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