Interconnect PVD Equipment IC7200

IC7200  Interconnect PVD Equipment(φ200mm support)

IC7200 is cluster PVD equipment for thin film deposition, main application of which is Semiconductor Interconnect process.

Fine uniformity and low level particle are achieved even in reactive PVD or high stress process by the original designed cathode (CAERA).

IC7200 is high reliable φ200mm PVD equipment which owns abundant process data.

IC7200  Interconnect PVD Equipment

Applications

Interconnect metal process for high volum manufactureing of semiconductor memory

Features

  • CAERA cathode has erosion contorol function by 3 axis magnet rotation
  • Target utilization is improved by CAERA cathode
  • PCM (Point Cusp Magent ) cathode is optional IC7200 cathode, which improves step coverage and reduces plasma damage

Specifications

System configuration:
Cluster type
Substrate size:
φ200mm


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