Sputtering Equipment for Magnetic Heads HC7100

HC7100 Sputtering Equipment for Magnetic Heads

HC7100 is a sputtering equipment for GMR heads and TMR heads that utilizes the tunnel effect.

HC7100 Sputtering Equipment for Magnetic Heads

Applications

Magnetic head production

Features

  • Offers excellent film thickness distribution of ±1% or less with the use of new sputtering technology LRP (Low Pressure Remote Plasma Sputtering).
  • Provides very flat and low resistance film with low pressure discharge at 0.02Pa, which is an order of magnitude lower than conventional sputtering pressure.
  • Provides high MR ratio with ultra-high vacuum.
  • Extensive deposition module lineup. (multi cathode specification)

Specifications

System configuration:
Cluster type
Substrate size:
φ150mm、φ200mm



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